Toward Holistic Design of Spatial Packaging of Interconnected Systems With Physical Interactions (SPI2)
This article explores a vision of a holistic SPI2 design approach needed to develop next-generation automated design methods that dramatically reduce the time needed to design SPI2 systems and to increase the complexity of designable systems.
Call for Papers: The Role of Design Artifacts in Design
The Journal of Mechanical Design invites submissions to the Special Issue on The Role of Design Artifacts in Design. Publication is planned for December 2023 and submissions are due April 30, 2023.
